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Single-Wafer Wet Process Eqpt.

Fully-auto Wafers Brushing Machine

Automatic wafer Brushing Machine can effectively remove the remaining physical particles on the wafer through the rotating brush head and two fluids, combined with DIW.It is mainly used for post-CMP cleaning and process cleaning of wafers.


產(chǎn)品詳情

? Compatible with a wide range of wafer specs

? Self-cleaning brush head

? Optional configure(wet in and dry out or dry in and out)

? Independent flipping module, automatic flipping and cleaning of both sides of the wafer

? Flexible chambers( 2/4/6/8 )configuring

? Excellent cleaning results

? A variety of safety tests(avoiding Debris producing)


Applicable Process     Wafer Clean,Mask Clean
Applicable Size     4&6 inch,6&8 inch,8&12 inch
Loadport type     Open Cassette,FOUP,SMIF
Chemicals     DIW
Particle     ≤10ea @0.3μm , ≤500ea @0.2μm
Frangementation Rate     ≤0.1‰